EQUIPMENT
12年坚持捍卫民族电工精工品质，千万次重复，品质始终如一，从模具到材料加工
设备分类
Equipment classification
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CONTACT US
0756-5160999
0756-5160999
xydzfpc008@xydzfpc.com
West 1-3 / F, No. 12, Yangqing Street, Jing 'an Xinqing Industrial Park, Doumen District, Zhuhai
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X-ray
Applicable process: after SMT solder paste printing and reflow welding, check circuit board after reflow welding, can check welding of BGA and other internal solder joint components, FPC line scanning
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·： 1. Applicable process: after SMT solder paste printing and reflow welding, check the circuit board after reflow welding, can check the welding of BGA and other internal solder joint components, FPC li
·： 2. 50° tilt meets the requirements of full-angle detection;
·： 3. Automatic target tracking;
·： 4. Maximum detection area 300x300mm
- 设备参数
-
·： 1. Applicable process: after SMT solder paste printing and reflow welding, check the circuit board after reflow welding, can check the welding of BGA and other internal solder joint components, FPC li
·： 2. 50° tilt meets the requirements of full-angle detection;
·： 3. Automatic target tracking;
·： 4. Maximum detection area 300x300mm